| Type |
CPU / Microprocessor |
| Market segment |
Server |
| Family |
Intel Xeon 5500 |
| Model number |
X5570 |
| CPU part numbers |
- AT80602000765AA is an OEM/tray microprocessor
- BX80602X5570 is a boxed microprocessor
|
| Frequency |
2933 MHz |
| Turbo frequency |
3333 MHz (1 core)
3200 MHz (4 cores) |
| Bus speed |
6.4 GT/s QPI (3200 MHz) |
| Package |
1366-land Flip-Chip Land Grid Array (FC-LGA8)
1.77" x 1.67" (4.5 cm x 4.25 cm) |
| Socket |
Socket 1366 / B / LGA1366 |
| Introduction date |
March 30, 2009 |
| End-of-Life date |
Last order date is September 28, 2012
Last shipment date for tray processors is March 27, 2015 |
| Price at introduction |
$1386 |
| S-spec numbers |
| |
ES/QS processors |
Production processors |
| Part number |
Q1DY |
Q1G9 |
SLBF3 |
| AT80602000765AA |
+ |
+ |
+ |
| BX80602X5570 |
|
|
+ | |
| Architecture / Microarchitecture |
| Microarchitecture |
Nehalem |
| Platform |
Tylersburg-EP
Tylersburg-EN
Tylersburg-WS |
| Processor core |
Nehalem-EP |
| Core steppings |
C1 (Q1DY)
D0 (Q1G9, SLBF3) |
| CPUID |
106A5 (SLBF3) |
| Manufacturing process |
0.045 micron
731 million transistors |
| Die size |
263mm2 |
| Data width |
64 bit |
| The number of CPU cores |
4 |
| The number of threads |
8 |
| Floating Point Unit |
Integrated |
| Level 1 cache size |
4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches |
| Level 2 cache size |
4 x 256 KB 8-way set associative caches |
| Level 3 cache size |
8 MB 16-way set associative shared cache |
| Physical memory |
144 GB |
| Multiprocessing |
Up to 2 processors |
| Features |
- MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
- EM64T / Extended Memory 64 technology / Intel 64
- NX / XD / Execute disable bit
- HT / Hyper-Threading technology
- VT-x / Virtualization technology
- VT-d / Virtualization for directed I/O
- TBT / Turbo Boost technology
|
| Low power features |
- Thread C1/C1E, C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology
|
| Integrated peripherals / components |
| Integrated graphics |
None |
| Memory controller |
The number of controllers: 1
Memory channels: 3
Supported memory: DDR3-800, DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 32
ECC supported: Yes |
| Other peripherals |
Quick Path Interconnect (2 links) |
| Electrical / Thermal parameters |
| V core |
0.75V - 1.35V |
| Minimum/Maximum operating temperature |
5°C - 75°C
5°C - 81°C |
| Maximum power dissipation |
197.97 Watt
155.56 Watt (sustained) |
| Thermal Design Power |
95 Watt |
